Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.
As a Power-Integrity engineer in the Packaging team, you will work with other packaging team members and cross-functional teams to define power delivery architecture and design and optimize the package for power integrity.You will ensure efficient and high-quality power delivery through the package. You will support feasibility studies, product design, and future technology evaluation to enable Tenstorrent’s chiplet-based products.This role is hybrid ideally based out of Toronto but we are also open to hiring in our other North America locations (Austin, TX, Santa Clara) We welcome candidates at various experience levels for this role.
During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.
Responsibilities:
- Work with layout engineers on power delivery network planning and build simulation models for the package and chiplet complexes.
- Collaborate with cross-functional teams from Silicon Architecture to PCB and System Integration
- Utilize industry-standard simulation tools (Ansys SI-Wave and HFSS-3D-layout) to perform power Integrity Analysis, including DC IR, frequency domain and time domain analysis and optimize distribution networks and high-speed channels between chiplets
- Develop automation routines for pre-layout design and simulation
- Explore new technologies, evaluate them, and enable the proper technologies on Tenstorrent products
Experience & Qualifications:
- 2-5 years of experience in power delivery and power integrity of high-power electronics
- Fundamental understanding of Power Integrity and Power Delivery for high-power AI/CPU products
- Familiarity with ANSYS tool set (Si-Wave, Q3D, CPA and HFSS-3D-Layout) for PI analysis
- Experience in VR/IVR modeling and design is a plus
- Experience in pre-layout modeling and analysis is a plus
- Ability to break complex problems into smaller problems and solve them
- Ability to deal with ambiguity and changing requirements and to come up with creative solutions
- Strong cross-functional communication and collaboration
Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.Due to U.S. Export Control laws and regulations, Tenstorrent is required to ensure compliance with licensing regulations when transferring technology to nationals of certain countries that have been licensing conditions set by the U.S. government.Our engineering positions and certain engineering support positions require access to information, systems, or technologies that are subject to U.S.
Export Control laws and regulations, please note that citizenship/permanent residency, asylee and refugee information and/or documentation will be required and considered as Tenstorrent moves through the employment process.If a U.S. export license is required, employment will not begin until a license with acceptable conditions is granted by the U.S. government. If a U.S. export license with acceptable conditions is not granted by the U.S. government, then the offer of employment will be rescinded.
