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Physical Design Engineer, DE, UK, CH, DK

Kandou BusDortmund, Germany | Delaware, United StatesHybrid

Challenges are our drive, innovation our calling. We at Kandou are a team of passionate accomplished professionals making a mark in the semiconductor industry. We're an innovative leader in high-speed and energy-efficient chip-chip link solutions critical to the evolution of the electronics industry, continuously developing to meet the demands of today's customers and tomorrow too. If you love to be part of a high-tech scale-up and are motivated by pushing your limits and challenging the status quo, we have an opportunity for you.
We are actively seeking a Physical Design Engineer based in either UK, Germany, Switzerland or DenmarkRequired competences - Experience

  • 10+ years’ experience in the semiconductor industry, with min. 5 years in a digital Physical Design technical leadership role
  • Experience on modern semiconductor process technologies including 28nm, 14/16nm, 7nm
  • Experienced user of EDA tools for design and verification such as, Cadence Genus and Innovus, LEC, Calibre/PVS DRC/LVS, parasitics extraction, EM and IR drop, ESD, etc.
  • Expertise in Timing Constraints and Static Timing Analysis (STA)
  • Experience in CPF/UPF technologies and flows is highly desirable
  • Exposure to flip-chip package technologies and wire bond package technologies
  • Experience in hierarchical floor planning and implementation
  • Experience in release management and tape out procedures
  • Experience in library setup and flow development with focus on cross project reusability
  • Experience in DFT methodologies and implementation schemesRequired

Competencies – SkillsRequired competences - Skills

  • Good understanding of RTL to GDS implementation flow (synthesis, P&R, LEC, PV)
  • Self-motivated, with strong sense of ownership and responsibility. Good communicator and team player
  • Good scripting capabilities (shell, TCL, Python, make) and good understanding of data management (revision control system)

Responsibility and AuthorityResponsibility and Authority

  • As a Physical Design Engineer, you will work closely with the Architecture, RTL, DFT teams to ensure first-time-right high-volume silicon production
  • Timing constraints improvement and timing constraints validation, signoff Static Timing Analysis and block-level timing closure
  • Synthesis, block level floor-planning, power grid design, place & route, clock tree synthesis, electromigration / IR-Drop analysis, power/signal integrity analysis, crosstalk analysis, formal equivalence checking and physical verification (DRC / LVS / Antenna)
  • Participate in developing improvements to scripts/methodologies/flows
  • Interact closely with the design team to understand requirements and implement solutions as also helping on providing design views for use with digital PD flows (LIB, LEF, DEF, GDS, SPEF, etc.)
  • Support IP and chip level integration
  • Support and interact with customers on requirements and IP delivery
  • Manage workload and schedule and report to internal management team

Education

  • Bachelors/Masters of Engineering in Electronics and Electrical Engineering/Computer Science (equivalent or higher)

Life at Kandou Bus

Headquartered in Lausanne, Switzerland and founded in 2011, Kandou Bus is an innovative interface technology company specializing in the invention, design, license and implementation of unmatched chip-to-chip link solutions. Kandou's Chordâ„¢ technology lowers power consumption and improves overall performance of semiconductors, unlocking new capabilities in electronic devices and systems.
Thrive Here & What We Value1. Dynamic Role within Kandou's Program Management Organization2. Growing Product Portfolio with Increasing Importance of Software3. Exciting Time for the Company4. Multifaceted and Influential Role within Kandou5. Breadth of Experience in Semiconductor Industry6. High-tech scale-up with opportunities for growth and challenging work7. Challenges are our drive, innovation our calling9. Innovative leader in highspeed and energy efficient chip-chip link solutions critical to the evolution of the electronics industry
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