About Atomic Machines:
Atomic Machines is ushering in a new era in micromanufacturing with its Matter Compiler (MC) technology. The MC enables new classes of micromachines to be designed and built by offering manufacturing processes and a materials library that is inaccessible to semiconductor manufacturing methods. The MC promises to unlock MEMS manufacturing both for the many device classes that never could be made by semiconductor methods but also to open up entirely new classes. Furthermore, the MC is fully digital in the way 3D printing is digital, but where 3D printing produces parts of a single material using a single process, the MC is a multi-process, multi-material technology: bits and raw materials go in and complete, functional micromachines come out. The Atomic Machines team has also created an exciting first device – one that was only made possible by the existence of the Matter Compiler – that we will be unveiling to the world soon. Our offices are in Berkeley and Santa Clara, California.
This position is full-time and is located in our Berkeley location, reporting to the Director of Process Engineering.
About this Role:
We are seeking an innovative engineer to design novel strategies for developing and integrating materials in market-defining commercial devices. In this role you will leverage your hands-on experience of processing and characterizing materials for high-performance microsystems, while applying your first-principles understanding of materials science and structure-property relationships. You will champion materials and processing design for manufacturing (DFM), incorporating a blend of conventional and novel processing techniques to engineer functional multi-material systems, e.g., thin films, alloys, and composites.
The ideal candidate is capable of carrying a materials processing technology through its entire life cycle from concept, to experimentation and prototyping, and then finally translating to our digital, autonomous manufacturing platform at scale.
What You’ll Do:
- Develop and implement innovative materials processing technologies to advance the functional performance of novel microsystems and their packaging. Design and execute experiments to map processing-structure-property relationships for a range of materials with a focus on metals and ceramics.
- Employ advanced thin-film processes (e.g., plasma, electrochemical, PVD, CVD, ALD) to create new enabling additive and subtractive techniques, including but not limited to bonding, welding, alloying, doping, etching, and lithography.
- Apply advanced bulk and surface characterization techniques to evaluate material and chemical structure (e.g., SEM, EDS, EBSD, XRF, XPS, XRD, TEM, X-ray radiography/CT).
- Develop and perform material property tests to evaluate the mechanical, electrical, magnetic, and thermal performance of thin films, interfaces, and bulk materials.
- Analyze, summarize, document, and report out developed procedures, experimental data, and key findings.
- Participate in process development and automation activities to inform system requirements for custom-built manufacturing tools.
- Communicate and work cross-functionally to integrate newly developed processes into pilot-scale and large-scale fabrication workflows.
- Lead process development and process automation activities to inform system requirements for custom-built manufacturing tools.
- Guide and mentor teammates cross-functionally to integrate newly developed processes into pilot-scale and large-scale fabrication workflows.
What You'll Need:
- Disciplines of study preferred: Materials, Mechanical Engineering, Chemical Engineering, or related fields.
- Hands-on lab experience developing thin-film material technologies for commercial applications.
- Proven record applying fundamental engineering principles to material interfaces (e.g., bonding, adhesion, failure, fatigue, and fracture of materials – excluding polymer adhesives).
- Working knowledge of metallurgical engineering principles.
- Experience using a variety of characterization techniques, such as SEM, EDS, EBSD, XRF, XPS, XRD, TEM, X-ray radiography/CT.
- Experience leading technical projects and mentoring other team members.
- Experience with material joining and advanced packaging is preferred.
- Experience with CAD software for 2D layouts is preferred.
- Bachelor’s degree, 10+ years of work experience. Master's degree preferred.
$165,000 - $210,000 a yearThe compensation for this position also includes equity and benefits.Apply for this job
